This topic will explore aspects of the new initiatives in the semiconductor industry funded by the CHIPs Act. The CHIPs Act establishes new research centers for IC technology (National Semiconductor Technology Center); a new center for packing including heterogeneous integration; a National Metrology Center at NIST; assists funding new IC manufacturing and packaging factories; and workforce development.
Areas of Interest: The CHIPS Act Mini-Symposium is seeking abstracts in the following areas of interest:
- National Semiconductor Technology Center
- IC Technology Roadmaps
- Packaging Technology Center
- Semiconductor Workforce Development
CPS1: CHIPS Act Mini-Symposium Oral Session
Erica Douglas, Sandia National Lab, “CHIPs Act Panel Session Chair”
Invited Speakers:
- Markus Kuhn, Rigaku, “Challenges and Opportunities in Characterization and Metrology for the Microelectronics and Advanced Packaging Technologies (MAPT) Roadmap”
- Nancy Louwagie, Normandale Community College
- Volker Sorger, University of Florida, “CHIPs Act and Optoelectronics, Devices, and AI/ML”
- Victor Zhirnov, SRC, “Strategic Roadmapping for Sustainable ICT”
CPS2: CHIPS Act Mini-Symposium Poster Session