The Plasma Science & Technology Division program highlights state-of-the-art advances in plasma science, ranging from fundamental studies of plasma physics and chemistry to plasma-matter interactions and new applications for plasma processing. Our diverse international community from academia, national facilities, and industry focuses on the latest advancements in plasma research as applied to semiconductor fabrication and processing, as well as newer areas including atmospheric pressure plasmas, chemical and energy conversion, novel materials synthesis, catalysis, and biomedical applications where plasma is the enabling tool. Novel applications of AI / ML to plasma processing are also encouraged.
For AVS 70, the PSTD is seeking abstracts that fall within the following themes:
Plasma Etching, Deposition, and Processing for Advanced Device Fabrication: State-of-the-art front (FEOL) and back (BEOL) end-of-line patterning and processing for logic devices, emerging memory applications, quantum devices, and photonics; advanced packaging, chiplets & heterogeneous integration.
Plasma Enhanced Atomic Layer Processing: Area selective deposition, characterization, and metrology to enable atomic scale processing, atomic layer process chemistry, surface reactions and atomic layer etching. Novel thin film deposition processes and material synthesis studies are also encouraged.
Plasmas and Plasma-Surface Interactions – experiment and modeling: Fundamental understanding of plasma-surface interactions, modeling and simulation challenges associated with plasma-based materials synthesis, processing, and etching; kinetic, fluid, hybrid and data-driven models; control; and experimental validation of simulations.
Plasma Sources, Diagnostics, Sensing, and Control: Novel plasma generation schemes and (ion beam) sources at low and high pressures; plasma diagnostics; pulsed plasmas and waveform shaping; process sensing and control schemes.
Plasmas for Chemical, Energy, and Sustainable Applications: Emerging venues where plasmas provide unique advantages in chemical, environmental, energy, and biological applications. New plasma processes for sustainable technologies (chemical conversion, batteries, fuel cells, electrochemistry, photovoltaics, low GWP gases) and atmospheric pressure processing. Making today’s processes more energy-efficient and environmentally friendly.
Areas of Interest: Plasma Science and Technology is seeking abstracts in the following areas of interest:
- Plasma Processing for Advanced Logic and Memory Device Fabrication
- Plasma Processing for Emerging Device Technologies
- Area Selective Processing and Patterning
- Plasma ALD/ALE
- Plasma Processes for Coatings and Thin Films
- Plasma Surface Interactions
- Plasma Modeling
- Plasma Sources, Diagnostics, Sensing and Control
- Plasma Chemistry, Catalysis and Applications for the Environment and Sustainability
- Atmospheric Pressure Plasmas and their Applications
PS1: Plasma Science and Technology Oral Session
Invited Speakers:
- Rebecca Anthony, Michigan State University, “Nonthermal Plasmas for Advanced Nanomanufacturing”
- Heeyeop Chae, Sungkyunkwan University (SKKU), Republic of Korea
- Timo Gans, Dublin City University, Ireland, “Sensing and Control of Radio-Frequency Driven Plasmas”
- Masaru Hori, Nagoya University, Japan
- Masaru Izawa, Hitachi High Technologies, Japan
- Michael Johnson, Naval Research Laboratory
- Kazunori Koga, Kyushu University, Japan, “Stress Reduction of Hydrogenated Amorphous Carbon Films by Controlling Incorporation of Carbon Nanoparticles”
- Amanda Lietz, North Carolina State University, “Modeling to Guide Optimization of Plasma Sources for Semiconductor Processing and Fusion”
- Youn-Jin Oh, LAM Research
- Kandabara Tapily, Tokyo Electron, “Technology Enablement by Area Selective Processes”
PS2: Plasma Science and Technology Poster Session