MEMS and NEMS (MN): The MEMS and NEMS Technology Group (MN) program will highlight recent advances in the broad areas of micro/nanoelectromechanical systems (MEMS/NEMS), especially the latest fundamental studies of novel materials and processes, devices, and emerging functions and applications of MEMS/NEMS, in various areas. Our program will include resonant low-dimensional materials and nonlinear MEMS/NEMS resonators, which create intriguing possibilities for integrating these devices with existing fluidic, electronic, and optical on-chip networks. The program continues to embrace the latest progress in 2.5D/3D heterogeneous integration/packaging, additive manufacturing, nanomechanics, optomechanics, quantum phononics, resonant systems, CMOS-MEMS, mesoscopic dynamics, dissipation processes, sensors and actuators, harsh-environment transducers, magnetoacoustics, and MEMS/NEMS-enabled energy technologies, etc. It also aims to capture some of the latest advances in soft materials, flexible and implantable MEMS/NEMS, wearable and wireless healthcare, environmental bio-MEMS, and bio-inspired microsystems. Poster presentations by undergraduate students are encouraged.
Areas of Interest: MEMS/NEMS is seeking abstracts in the following areas of interest:
- Quantum Phononics and Optomechanics (Joint Session with Quantum Science): Optomechanical and Phononic Devices and Systems in Quantum Regimes.
- Bio MEMS/Environmental MEMS: Soft Materials, Flexible and Implantable MEMS/NEMS, Wearable and Wireless Healthcare, Bio-MEMS, Environmental MEMS, and Bio-inspired Microsystems.
- RF MEMS/Magnetic MEMS: Emerging Materials (WBG, UWBG, piezoelectric, and magnetic materials), Designs, and Resonant MEMS and Magnetoacoustic Devices.
- Nanomechanics: Resonant Low-Dimensional (1D, 2D) Materials, Nonlinear Resonators, and Coupled Resonators for Emerging Applications.
- Microscale Additive Manufacturing: Design and Fabrication of 3D Microscale Devices, Systems, and Packaging based on Additive Manufacturing Techniques.
- Heterogeneous Integration/Packaging: Advanced Integration and Packaging Techniques, including Heterogeneous Integration, Bulk and Surface Micromachining, and Wafer Bonding.
MN1: MEMS and NEMS Oral Session
Invited Speakers:
- Reza Abdolvand, University of Central Florida
- Bob Patti, NHanced Semiconductors
MN2: MEMS and NEMS Poster Session