The Electronic Materials and Photonics Division encompasses all experimental and theoretical aspects underpinning the structure-property-synthesis correlations of new materials and their integration into devices. The division welcomes abstracts focused on reporting advances in four broad topical areas. The Advances in Photonic Materials and Devices Session will highlight the materials and process challenges of electronic and photonic devices that exploit plasmonics, metamaterials, and metasurfaces as platforms for enhanced light-matter interaction. The Ferroelectrics and Memory Devices Session will highlight materials and integration of novel memory devices including ferroelectrics, low-dimensional and topological materials with CMOS technology. The CMOS and BEOL – Advances in Materials Integration and Devices Session will focus on manufacturing aspects of semiconductor materials, processes, and integration, as applied to low-power logic, memory, and high-to-ultrahigh wide bandgap devices. Manufacturing strategies that enable 2D materials-based devices, new interconnects and BEOL devices are welcome. Last, Epitaxy: Advances in Materials Integration and Devices session will focus on the latest advancements in the field of molecular beam epitaxy with a focus on new modalities of deposition, materials, metrology, and characterization.
A Flash Poster session is being organized to encourage poster presenters to showcase their work as part of the oral sessions. As in past years, we will offer multiple awards including a graduate student poster and presentation awards as well as post-doc and graduate student travel awards to help create a forum in which younger scientists can present their work and develop relationships for the future.
EM+2D+BI+QS+TF-TuA: Advances in Photonic Materials and Devices
- Vivian Ferry, University of Minnesota, “New Materials for Metamaterials: Electrochemical Materials and Switchable Chiral Nanostructures”
EM+AIML+AP+QS+TF-WeM: Ferroelectrics and Memory Devices
- Todd Bauer, DARPA, “Innovations in DARPA’s Optimum Processing Technology Inside Memory Arrays (OPTIMA) Program”
- Uwe Schroeder, Namlab, Germany, “Thin Film Physics of Ferroelectric HfO2 and ZrO2 – From Laboratory Demonstrations to Semiconductor Chips”
EM+AP+TF-WeA: CMOS and BEOL – Advances in Materials Integration and Devices
- Matt Eichenfeld, University of Arizona, “All-Acoustic and Single-Chip Radio Frequency Signal Processing via Heterogeneous Integration of Semiconductors and Piezoelectric Materials”
EM+2D+AP+QS+TF-ThM: Epitaxy: Advances in Materials Integration and Devices
EM-ThP: Electronic Materials and Photonics Poster Session